Invention Grant
- Patent Title: Modular microwave source with local lorentz force
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Application No.: US17338510Application Date: 2021-06-03
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Publication No.: US11721532B2Publication Date: 2023-08-08
- Inventor: Philip Allan Kraus , Thai Cheng Chua , Mani Subramani
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01J27/18 ; H05H1/46 ; C23C16/511 ; C23C14/35

Abstract:
Embodiments include methods and apparatuses that include a plasma processing tool that includes a plurality of magnets. In one embodiment, a plasma processing tool may comprise a processing chamber and a plurality of modular microwave sources coupled to the processing chamber. In an embodiment, the plurality of modular microwave sources includes an array of applicators positioned over a dielectric plate that forms a portion of an outer wall of the processing chamber, and an array of microwave amplification modules. In an embodiment, each microwave amplification module is coupled to one or more of the applicators in the array of applicators. In an embodiment, the plasma processing tool may include a plurality of magnets. In an embodiment, the magnets are positioned around one or more of the applicators.
Public/Granted literature
- US20210287882A1 MODULAR MICROWAVE SOURCE WITH LOCAL LORENTZ FORCE Public/Granted day:2021-09-16
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