Invention Grant
- Patent Title: Mainframe-less wafer transfer platform with linear transfer system for wafer processing modules
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Application No.: US16989746Application Date: 2020-08-10
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Publication No.: US11721583B2Publication Date: 2023-08-08
- Inventor: Sriskantharajah Thirunavukarasu , Karthik Balakrishnan , Karthik Elumalai , Eng Sheng Peh
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/673 ; H01L21/677 ; B23K26/364 ; H01L23/544 ; B23K101/40
Abstract:
In an embodiment, a semiconductor processing tool for implementing hybrid laser and plasma dicing of a substrate is provided. The semiconductor processing tool comprises a transfer module, where the transfer module comprises a track robot for handling the substrate, and a loadlock attached to the transfer module. In an embodiment, the loadlock comprises a linear transfer system for handling the substrate. In an embodiment, the processing tool further comprises a processing chamber attached to the loadlock, wherein the linear transfer system of the loadlock is configured to insert and remove the substrate from the processing chamber.
Information query
IPC分类:
