Invention Grant
- Patent Title: Method of forming semiconductor device package having testing pads on an upper die
-
Application No.: US17722935Application Date: 2022-04-18
-
Publication No.: US11721598B2Publication Date: 2023-08-08
- Inventor: Chen-Hua Yu , Sung-Feng Yeh , Ming-Fa Chen , Hsien-Wei Chen , Hui-Wen Liu , Ching-Pin Yuan
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- The original application number of the division: US16023504 2018.06.29
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L21/66 ; H01L23/31 ; H01L23/544 ; H01L23/00 ; H01L25/065
Abstract:
In an embodiment, a method includes: stacking a plurality of first dies to form a device stack; revealing testing pads of a topmost die of the device stack; testing the device stack using the testing pads of the topmost die; and after testing the device stack, forming bonding pads in the topmost die, the bonding pads being different from the testing pads.
Public/Granted literature
- US20220238398A1 Methods of Forming Semiconductor Device Packages Public/Granted day:2022-07-28
Information query
IPC分类:
