Invention Grant
- Patent Title: Semiconductor storage device and manufacturing method thereof
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Application No.: US17190713Application Date: 2021-03-03
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Publication No.: US11721625B2Publication Date: 2023-08-08
- Inventor: Yosuke Mitsuno , Tatsufumi Hamada , Shinichi Sotome , Tomohiro Kuki
- Applicant: Kioxia Corporation
- Applicant Address: JP Tokyo
- Assignee: KIOXIA CORPORATION
- Current Assignee: KIOXIA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP 20087668 2020.05.19
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H10B41/27 ; H10B43/27 ; H01L21/768 ; H01L23/522

Abstract:
A semiconductor storage device includes: conductive layers arranged in a first direction; a first insulating layer extending in the first direction; a first semiconductor layer between the conductive layers and the first insulating layer; and a gate insulating film between the conductive layers and the first semiconductor layer. The first semiconductor layer includes a first region between a first insulating portion and the first conductive layer, a second region between a second insulating portion and the second conductive layer, and a third region between the first region and the second region. The third region includes a fourth region extending in a second direction, a fifth region between the first region and the fourth region, a sixth region between the second region and the fourth region, and a seventh region between the fifth region and the first region and extending in the first direction.
Public/Granted literature
- US11854971B2 Semiconductor storage device and manufacturing method thereof Public/Granted day:2023-12-26
Information query
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