Invention Grant
- Patent Title: Conductive structure and wiring structure including the same
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Application No.: US17157795Application Date: 2021-01-25
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Publication No.: US11721634B2Publication Date: 2023-08-08
- Inventor: Wen Hung Huang
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/49 ; H01L23/13 ; H01L23/52 ; H01L23/538 ; H01L21/48 ; H01L21/52 ; H01L21/56
Abstract:
A conductive structure includes a core portion, a plurality of electronic devices and a filling material. The core portion defines a cavity. The electronic devices are disposed in the cavity of the core portion. The filling material is disposed between the electronic devices and a sidewall of the cavity of the core portion.
Public/Granted literature
- US20210151381A1 CONDUCTIVE STRUCTURE AND WIRING STRUCTURE INCLUDING THE SAME Public/Granted day:2021-05-20
Information query
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