Invention Grant
- Patent Title: Circuit die alignment target
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Application No.: US16603821Application Date: 2018-04-15
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Publication No.: US11721636B2Publication Date: 2023-08-08
- Inventor: Anthony M. Fuller , Michael W. Cumbie , Chien-Hua Chen
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Foley & Lardner LLP
- International Application: PCT/US2018/027690 2018.04.15
- International Announcement: WO2019/203780A 2019.10.24
- Date entered country: 2019-10-08
- Main IPC: H01L23/544
- IPC: H01L23/544 ; B41J2/175 ; H01L21/68
Abstract:
A circuit die may include an outermost circuit layer having electrical transmission routing and an alignment target overlying the outermost circuit layer.
Public/Granted literature
- US20210402782A1 CIRCUIT DIE ALIGNMENT TARGET Public/Granted day:2021-12-30
Information query
IPC分类:
