Invention Grant
- Patent Title: Package structure
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Application No.: US17350317Application Date: 2021-06-17
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Publication No.: US11721643B2Publication Date: 2023-08-08
- Inventor: Po-Chen Lai , Chin-Hua Wang , Ming-Chih Yew , Che-Chia Yang , Shu-Shen Yeh , Po-Yao Lin , Shin-Puu Jeng
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/31 ; H01L23/538 ; H01L25/065 ; H01L21/683 ; H01L21/48 ; H01L21/56
Abstract:
A package structure is provided. The package structure includes a redistribution structure and a semiconductor die over the redistribution structure, and bonding elements below the redistribution structure. The semiconductor die has a first sidewall and a second sidewall connected to each other. The bonding elements include a first row of bonding elements and a second row of bonding elements. In a plan view, the second row of bonding elements is arranged between the first row of bonding elements and an extending line of the second sidewall. A minimum distance between the second row of bonding elements and the first sidewall is greater than the minimum distance between the first row of bonding elements and the first sidewall.
Public/Granted literature
- US20220406730A1 PACKAGE STRUCTURE Public/Granted day:2022-12-22
Information query
IPC分类:
