Invention Grant
- Patent Title: Power module
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Application No.: US17203938Application Date: 2021-03-17
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Publication No.: US11721670B2Publication Date: 2023-08-08
- Inventor: Takashi Tsubakidani , Kosuke Yamaguchi
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP 20096847 2020.06.03
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H03K17/687 ; H01L25/18 ; H03K17/0812 ; H01L23/00

Abstract:
A second semiconductor switching element is connected in series with a first semiconductor switching element, and is at least partially stacked on the first semiconductor switching element in the thickness direction. A first control element controls the first semiconductor switching element and the second semiconductor switching element, and performs an overcurrent protection operation with reference to a shunt voltage. The first control element is arranged outside the first semiconductor switching element and the second semiconductor switching element in the in-plane direction.
Public/Granted literature
- US20210384163A1 POWER MODULE Public/Granted day:2021-12-09
Information query
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