Invention Grant
- Patent Title: Light emitting device and light emitting module
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Application No.: US17573633Application Date: 2022-01-12
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Publication No.: US11721682B2Publication Date: 2023-08-08
- Inventor: Takashi Ishii , Dai Wakamatsu , Hiroaki Kageyama
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Mori & Ward, LLP
- Priority: JP 19125235 2019.07.04 JP 19133169 2019.07.18
- Main IPC: H01L25/16
- IPC: H01L25/16 ; H01L33/50 ; H01L33/56 ; H01L33/48 ; H01L33/64 ; H01L33/30
Abstract:
A light emitting device including a plurality of element structures each including a submount, a light emitting element, and a light transmissive member, in this order. The light emitting device further includes a first cover member holding the element structures by covering lateral faces of each of the element structures.
Public/Granted literature
- US20220139893A1 LIGHT EMITTING DEVICE AND LIGHT EMITTING MODULE Public/Granted day:2022-05-05
Information query
IPC分类:
