Invention Grant
- Patent Title: Field-effect transistor and method of forming the same
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Application No.: US17224509Application Date: 2021-04-07
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Publication No.: US11721741B2Publication Date: 2023-08-08
- Inventor: Chen-Ping Chen , Chih-Han Lin , Ming-Ching Chang , Chao-Cheng Chen
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- Current Assignee Address: TW Hsinchu
- Agency: Foley & Lardner LLP
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L29/78 ; H01L29/08 ; H01L29/06 ; H01L29/66 ; H01L29/786 ; H01L21/28 ; H01L29/423

Abstract:
A semiconductor device is disclosed. The semiconductor device includes a substrate including a semiconductor material. The semiconductor device includes a conduction channel of a transistor disposed above the substrate. The conduction channel and the substrate include a similar semiconductor material. The semiconductor device includes a source/drain region extending from an end of the conduction channel. The semiconductor device includes a dielectric structure. The source/drain region is electrically coupled to the conduction channel and electrically isolated from the substrate by the dielectric structure.
Public/Granted literature
- US20220328646A1 FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME Public/Granted day:2022-10-13
Information query
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