- Patent Title: Integrated circuit, transistor and method of fabricating the same
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Application No.: US17400138Application Date: 2021-08-12
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Publication No.: US11721747B2Publication Date: 2023-08-08
- Inventor: Yu-Wei Jiang , Sheng-Chih Lai , Feng-Cheng Yang , Chung-Te Lin
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L51/30 ; H01L29/78 ; H01L23/528 ; H10B51/30

Abstract:
A transistor includes a gate electrode, a ferroelectric layer, a channel layer, a gas impermeable layer, a dielectric layer, a source line and a bit line. The ferroelectric layer is disposed on the gate electrode. The channel layer is disposed on the ferroelectric layer. The gas impermeable layer is disposed in between the channel layer and the gate electrode, and in contact with the ferroelectric layer. The dielectric layer is surrounding the ferroelectric layer and the channel layer, and in contact with the gas impermeable layer. The source line and the bit line are embedded in the dielectric layer and connected to the channel layer.
Public/Granted literature
- US20230045806A1 INTEGRATED CIRCUIT, TRANSISTOR AND MEHTOD OF FABRICATING THE SAME Public/Granted day:2023-02-16
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