Invention Grant
- Patent Title: Semiconductor structure and associated fabricating method
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Application No.: US17103611Application Date: 2020-11-24
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Publication No.: US11721758B2Publication Date: 2023-08-08
- Inventor: Jia-Rui Lee , Kuo-Ming Wu , Yi-Chun Lin
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT Law
- Agent Anthony King
- The original application number of the division: US15719500 2017.09.28
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/762 ; H01L29/06 ; H01L29/423 ; H01L21/76 ; H01L29/66

Abstract:
A semiconductor structure is disclosed. The semiconductor structure includes: a substrate; an isolation region adjacent to the drain region; a gate electrode over the substrate and further downwardly extends into the substrate, wherein a portion of the gate electrode below a top surface of the substrate abuts the isolation region; and a source region and a drain region formed in the substrate on either side of the gate structure. An associated method for fabricating the semiconductor structure is also disclosed.
Public/Granted literature
- US20210074854A1 SEMICONDUCTOR STRUCTURE AND ASSOCIATED FABRICATING METHOD Public/Granted day:2021-03-11
Information query
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