Invention Grant
- Patent Title: Method for manufacturing reflective structure
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Application No.: US17675365Application Date: 2022-02-18
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Publication No.: US11721794B2Publication Date: 2023-08-08
- Inventor: Chia-Hua Lin , Yao-Wen Chang , Chii-Ming Wu , Cheng-Yuan Tsai , Eugene I-Chun Chen , Tzu-Chung Tsai
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT Law
- Agent Anthony King
- Main IPC: H01L33/60
- IPC: H01L33/60 ; H01L33/62 ; H01L27/15

Abstract:
A method for manufacturing reflective structure is provided. The method includes the operations as follows. A metallization structure is received. A plurality of conductive pads are formed over the metallization structure. A plurality of dielectric stacks are formed over the conductive pads, respectively, wherein the thicknesses of the dielectric stacks are different. The dielectric stacks are isolated by forming a plurality of trenches over a plurality of intervals between each two adjacent dielectric stacks.
Public/Granted literature
- US20220173290A1 METHOD FOR MANUFACTURING REFLECTIVE STRUCTURE Public/Granted day:2022-06-02
Information query
IPC分类: