- Patent Title: Semiconductor package with antenna and method of forming the same
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Application No.: US17185850Application Date: 2021-02-25
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Publication No.: US11721883B2Publication Date: 2023-08-08
- Inventor: Wen-Shiang Liao
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01Q5/00
- IPC: H01Q5/00 ; H01Q1/22 ; H01Q9/04 ; H01Q1/48 ; H01Q1/40
Abstract:
A semiconductor package includes a semiconductor die, an encapsulation layer and at least one antenna structure. The encapsulation layer laterally encapsulates the semiconductor die. The at least one antenna structure is embedded in the encapsulation layer aside the semiconductor die. The at least one antenna structure includes a dielectric bulk, and a dielectric constant of the dielectric bulk is higher than a dielectric constant of the encapsulation layer.
Public/Granted literature
- US20220271414A1 SEMICONDUCTOR PACKAGE WITH ANTENNA AND METHOD OF FORMING THE SAME Public/Granted day:2022-08-25
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