Invention Grant
- Patent Title: Radio frequency duplexer circuit and radio frequency substrate
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Application No.: US17514895Application Date: 2021-10-29
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Publication No.: US11722115B2Publication Date: 2023-08-08
- Inventor: Xiyuan Wang , Feng Qu
- Applicant: Beijing BOE Technology Development Co., Ltd. , BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: Beijing BOE Technology Development Co., Ltd.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: Beijing BOE Technology Development Co., Ltd.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing; CN Beijing
- Agency: Houtteman Law LLC
- Priority: CN 2110308189.0 2021.03.23
- Main IPC: H03H7/46
- IPC: H03H7/46 ; H03H7/01

Abstract:
The present disclosure provides a radio frequency duplexer circuit and a radio frequency substrate. The radio frequency duplexer circuit includes a first terminal, a second terminal, a third terminal, a low-pass filter, and a high-pass filter. The low-pass filter includes N first filter sub-circuits coupled in series and a first tuning sub-circuit. Among the N first filter sub-circuits coupled in series, a first end of a 1st first filter sub-circuit is coupled to the first terminal, and a second end of a Nth first filter sub-circuit is coupled to the second terminal. The high-pass filter includes M second filter sub-circuits coupled in series and a second tuning sub-circuit. Among the M second filter sub-circuits coupled in series, a first end of a 1st second filter sub-circuit is coupled to the first terminal, and a second end of a Mth second filter sub-circuit is coupled to the third terminal.
Public/Granted literature
- US20220311406A1 RADIO FREQUENCY DUPLEXER CIRCUIT AND RADIO FREQUENCY SUBSTRATE Public/Granted day:2022-09-29
Information query
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