Invention Grant
- Patent Title: Assembly type edge system
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Application No.: US17764488Application Date: 2021-10-22
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Publication No.: US11722586B2Publication Date: 2023-08-08
- Inventor: Joohwan Noh , Sangiin Yun , Byung-hoon Kim
- Applicant: SDPlex Co., Ltd.
- Applicant Address: KR Seoul
- Assignee: SDPLEX CO, , LTD.
- Current Assignee: SDPLEX CO, , LTD.
- Current Assignee Address: KR Seoul
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Priority: KR 20200138211 2020.10.23
- International Application: PCT/KR2021/014974 2021.10.22
- International Announcement: WO2022/086298A 2022.04.28
- Date entered country: 2022-03-28
- Main IPC: G06F15/16
- IPC: G06F15/16 ; H04L69/08 ; H04L67/75 ; H04L67/00 ; H04L69/18

Abstract:
This application relates to an assembly type edge system. In one aspect, the edge system includes M protocol modules connected to and interworked with the at least one interworking target device according to a specified interworking protocol, and a collection module configured to collect a collection data set of a specified collection data structure through at least one protocol module. The system may also include P processing modules configured to generate n (1≤n≤N) pieces of data to be transmitted to a specified higher-level system, and S structuring modules configured to generate a transmission data set by structuring a data group including the n pieces of data. The system may also include T communication modules configured to apply a specified communication protocol to the transmission data set, and transmit the transmission data set to a specified higher-level system, and a control module configured to control one or more of the modules.
Public/Granted literature
- US20220368780A1 ASSEMBLY TYPE EDGE SYSTEM Public/Granted day:2022-11-17
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