Invention Grant
- Patent Title: Imaging device and imaging system having a stacked structure for pixel portion and signal processing circuit portion
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Application No.: US17646056Application Date: 2021-12-27
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Publication No.: US11722804B2Publication Date: 2023-08-08
- Inventor: Noritaka Ikeda
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Chip Law Group
- Priority: JP 18093445 2018.05.15
- Main IPC: H04N5/232
- IPC: H04N5/232 ; H04N25/79 ; H04N23/80 ; H04N25/74 ; H04N5/376

Abstract:
The need for miniaturizing camera modules is to be effectively satisfied. There are provided a pixel unit, an image processing unit that processes an image signal generated by the pixel unit, an encoding unit that encodes the image signal processed by the image processing unit, and an address assignment unit that assigns an address to a compressed signal encoded by the encoding unit. The pixel unit is provided on a first substrate. The image processing unit, the encoding unit, and the address assignment unit are provided on a second substrate to be stacked on the first substrate.
Public/Granted literature
- US20220124274A1 IMAGING DEVICE AND IMAGING SYSTEM Public/Granted day:2022-04-21
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