- Patent Title: Methods of creating exposed cavities in molded electronic devices
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Application No.: US17719348Application Date: 2022-04-12
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Publication No.: US11723151B2Publication Date: 2023-08-08
- Inventor: Dongkai Shangguan , David Geiger , Venkat Iyer , Cheng Yang
- Applicant: FLEX LTD
- Applicant Address: SG Singapore
- Assignee: FLEX LTD
- Current Assignee: FLEX LTD
- Current Assignee Address: SG Singapore
- Agency: Weber Rosselli & Cannon LLP
- Priority: CN 1910919566.7 2019.09.26
- Main IPC: H05K3/00
- IPC: H05K3/00 ; H05K3/28
Abstract:
Methods include receiving at least one electronic device including a sensor or an emitter, placing a cover over the sensor or emitter, placing the electronic device, including the cover, into a transfer mold system, encapsulating the electronic device with charge material, and removing a portion of the encapsulating charge material and the cover to expose the sensor or emitter to the environment.
Public/Granted literature
- US20220330435A1 METHODS OF CREATING EXPOSED CAVITIES IN MOLDED ELECTRONIC DEVICES Public/Granted day:2022-10-13
Information query
