An electronic apparatus includes a cylindrical housing, a first functional member, a second functional member, and a heat dissipation assembly. The cylindrical housing includes an air inlet structure and an air outlet structure. The first functional member and the second functional member are arranged in the cylindrical housing. The first functional member and the second functional member are alternately arranged. The heat dissipation assembly is arranged in the cylindrical housing. The first functional member and the second functional member are thermally connected to two heat transfer contact surfaces of the heat dissipation assembly, respectively. The heat dissipation assembly is configured to perform heat dissipation processing on the first functional member and the second functional member.