Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
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Application No.: US17372880Application Date: 2021-07-12
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Publication No.: US11723189B2Publication Date: 2023-08-08
- Inventor: Eun Young Lee , Do Hyung Kim , Taek Jung Kim , Seung Jong Park , Jae Wha Park , Youn Jae Cho
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Lee IP Law, P.C.
- Priority: KR 20200165802 2020.12.01
- Main IPC: H10B12/00
- IPC: H10B12/00 ; H01L23/528 ; H01L23/532 ; H10N50/01 ; H10N50/80

Abstract:
A semiconductor device and a method of fabricating a semiconductor device, the device including a substrate including an element isolation film and an active region defined by the element isolation film; a word line crossing the active region in a first direction; and a bit line structure on the substrate and connected to the active region, the bit line structure extending in a second direction crossing the first direction, wherein the bit line structure includes a first cell interconnection film including an amorphous material or ruthenium, a second cell interconnection film on and extending along the first cell interconnection film and including ruthenium, and a cell capping film on and extending along the second cell interconnection film.
Public/Granted literature
- US20220173108A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2022-06-02
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