Invention Grant
- Patent Title: Substrate for flexible device and method for producing the same
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Application No.: US17377246Application Date: 2021-07-15
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Publication No.: US11723262B2Publication Date: 2023-08-08
- Inventor: Toshihiko Miyazaki , Hirohisa Masuda , Hiroshi Shimomura , Kouji Nanbu
- Applicant: TOYO SEIKAN GROUP HOLDINGS, LTD.
- Applicant Address: JP Tokyo
- Assignee: TOYO SEIKAN GROUP HOLDINGS, LTD.
- Current Assignee: TOYO SEIKAN GROUP HOLDINGS, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP 16063335 2016.03.28 JP 16063337 2016.03.28 JP 16063341 2016.03.28 JP 17037333 2017.02.28 JP 17042159 2017.03.06 JP 17042160 2017.03.06
- The original application number of the division: US16088273
- Main IPC: H10K77/10
- IPC: H10K77/10 ; C03C3/066 ; C03C3/068 ; C03C3/14 ; H10K50/828 ; H10K71/00 ; C03C8/04 ; C03C8/16 ; H10K30/80 ; H10K102/00

Abstract:
A substrate for flexible device. The substrate has a nickel-plated metal sheet having a nickel-plating layer formed on at least one surface of a metal sheet or a nickel-based sheet, and a glass layer of an electrically-insulating layered bismuth-based glass on a surface of the nickel-plating layer or the nickel-based sheet. An oxide layer having a roughened surface is formed on the surface of the nickel-plating layer or the surface of the nickel-based sheet, and the bismuth-based glass contains 70 to 84% by weight of Bi2O3, 10 to 12% by weight of ZnO, and 6 to 12% by weight of B2O3. Also disclosed is a method for producing the substrate for flexible device, a substrate for an organic EL device, a sheet used as a substrate for flexible device, a method for producing the sheet and a bismuth-based lead-free glass composition.
Public/Granted literature
- US20210343956A1 SUBSTRATE FOR FLEXIBLE DEVICE AND METHOD FOR PRODUCING THE SAME Public/Granted day:2021-11-04
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