Invention Grant
- Patent Title: Method of manufacturing magnetic tunnel junction (MTJ) device
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Application No.: US17956772Application Date: 2022-09-29
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Publication No.: US11723287B2Publication Date: 2023-08-08
- Inventor: Da-Jun Lin , Shih-Wei Su , Bin-Siang Tsai , Ting-An Chien
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- The original application number of the division: US16916037 2020.06.29
- Main IPC: H01L27/22
- IPC: H01L27/22 ; H01L43/02 ; H01L43/08 ; H01L43/10 ; H01L43/12 ; H10N50/80 ; H10B61/00 ; H10N50/01 ; H10N50/85

Abstract:
A magnetic tunnel junction (MTJ) device includes a bottom electrode, a reference layer, a tunnel barrier layer, a free layer and a top electrode. The bottom electrode and the top electrode are facing each other. The reference layer, the tunnel barrier layer and the free layer are stacked from the bottom electrode to the top electrode, wherein the free layer includes a first ferromagnetic layer, a spacer and a second ferromagnetic layer, wherein the spacer is sandwiched by the first ferromagnetic layer and the second ferromagnetic layer, wherein the spacer includes oxidized spacer sidewall parts, the first ferromagnetic layer includes first oxidized sidewall parts, and the second ferromagnetic layer includes second oxidized sidewall parts. The present invention also provides a method of manufacturing a magnetic tunnel junction (MTJ) device.
Public/Granted literature
- US20230017965A1 METHOD OF MANUFACTURING MAGNETIC TUNNEL JUNCTION (MTJ) DEVICE Public/Granted day:2023-01-19
Information query
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