Invention Grant
- Patent Title: Multilayer capacitor
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Application No.: US17865968Application Date: 2022-07-15
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Publication No.: US11728093B2Publication Date: 2023-08-15
- Inventor: Jeong In Kim , Min Jun Kim , Byung Kil Seo , Mi Ok Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20190114337 2019.09.17 KR 20200057564 2020.05.14
- Main IPC: H01G4/12
- IPC: H01G4/12 ; H01G4/30 ; H01G2/06 ; H01G4/012

Abstract:
A multilayer capacitor includes a capacitor body in which a first capacitor portion and a second capacitor portion are disposed to face each other with a connection region disposed therebetween, the connection portion having a predetermined thickness in which an internal electrode is not formed. The first capacitor portion comprises first and second internal electrodes that are alternately disposed with a dielectric layer interposed therebetween, and the second capacitor portion comprises third and fourth internal electrodes that are alternately disposed with a dielectric layer interposed therebetween. First and second external electrodes connected to the internal electrodes respectively comprise first and second internal layers containing copper (Cu), and first and second external layers containing silver (Ag) or nickel (Ni), and palladium (Pd).
Public/Granted literature
- US11776746B2 Multilayer capacitor Public/Granted day:2023-10-03
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