Invention Grant
- Patent Title: Electronic device and method for connecting ground node to camera module
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Application No.: US17425209Application Date: 2020-01-22
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Publication No.: US11729499B2Publication Date: 2023-08-15
- Inventor: Changrim Yu , Yongwoog Shin , Yonghyun Park , Hyunseung Yoon
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Nixon & Vanderhye, P.C.
- Priority: KR 20190009307 2019.01.24
- International Application: PCT/KR2020/001064 2020.01.22
- International Announcement: WO2020/153738A 2020.07.30
- Date entered country: 2021-07-22
- Main IPC: H04N23/661
- IPC: H04N23/661 ; H04N23/57 ; H04N23/65

Abstract:
An electronic device according to various embodiments comprises: an antenna; a camera module; at least one capacitor; a switching circuit; and a controller operatively coupled to the antenna, the camera module, the at least one capacitor, and the switching circuit, wherein the controller, in a state where the at least one capacitor that is connected in parallel to a power supply node inputted to the camera module is connected to a first node by the switching circuit, identifies a wireless signal related to the antenna, and in response to an identification of the wireless signal, controls the switching circuit to thereby connect the at least one capacitor from the first node to a second node distinguished from the first node.
Public/Granted literature
- US20220086328A1 ELECTRONIC DEVICE AND METHOD FOR CONNECTING GROUND NODE TO CAMERA MODULE Public/Granted day:2022-03-17
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