Invention Grant
- Patent Title: Resin particles
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Application No.: US17506677Application Date: 2021-10-21
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Publication No.: US11732099B2Publication Date: 2023-08-22
- Inventor: Hideaki Yoshikawa , Kenji Yao , Masahiro Oki , Kazusei Yoshida , Tetsuya Taguchi
- Applicant: FUJIFILM Business Innovation Corp.
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Business Innovation Corp.
- Current Assignee: FUJIFILM Business Innovation Corp.
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- Priority: JP 21052445 2021.03.25
- Main IPC: C08J7/04
- IPC: C08J7/04 ; C08K5/11

Abstract:
Resin particles include mother particles containing a biodegradable resin, in which an alkali metal atomic weight A present on a resin particle surface with respect to a total atomic weight present on the resin particle surface, which is measured by an X-ray photoelectron spectroscopy, and an alkali metal atomic weight B present in the resin particles with respect to the total atomic weight present on the resin particles, which is measured by a fluorescent X-ray spectroscopy, satisfy a relationship of 0≤(A/B)
Public/Granted literature
- US20220306823A1 RESIN PARTICLES Public/Granted day:2022-09-29
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