Invention Grant
- Patent Title: Inertial sensor
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Application No.: US17703164Application Date: 2022-03-24
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Publication No.: US11740087B2Publication Date: 2023-08-29
- Inventor: Shota Harada , Keitaro Ito , Katsuaki Goto , Yuuki Inagaki , Takahiko Yoshida , Yusuke Kawai , Teruhisa Akashi , Hirofumi Funabashi
- Applicant: DENSO CORPORATION , TOYOTA JIDOSHA KABUSHIKI KAISHA , MIRISE Technologies Corporation
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION,TOYOTA JIDOSHA KABUSHIKI KAISHA,MIRISE Technologies Corporation
- Current Assignee: DENSO CORPORATION,TOYOTA JIDOSHA KABUSHIKI KAISHA,MIRISE Technologies Corporation
- Current Assignee Address: JP Kariya; JP Toyota; JP Nisshin
- Agency: POSZ LAW GROUP, PLC
- Priority: JP 21057614 2021.03.30
- Main IPC: G01C19/56
- IPC: G01C19/56 ; G01S19/47

Abstract:
A micro vibration body includes a curved surface portion, a recessed portion recessed from the curved surface portion, a bottom surface protruding portion protruding from a bottom surface of the recessed portion, and a through hole in the bottom surface protruding portion. A mounting substrate has a positioning recess, into which the bottom surface protruding portion is inserted, and electrode portions surrounding the inner frame portion. A joining member is in the positioning recess and joins the bottom surface protruding portion with the mounting substrate. The bottom surface is in contact with a region of the mounting substrate around the positioning recess. The bottom surface protruding portion has a tip end surface that is at a distance from the positioning recess. The joining member at least partially enters the through hole and is electrically connected to the conductive layer.
Public/Granted literature
- US20220316880A1 INERTIAL SENSOR Public/Granted day:2022-10-06
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