Invention Grant
- Patent Title: System and method for laser assisted bonding of an electronic device
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Application No.: US17005021Application Date: 2020-08-27
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Publication No.: US11742216B2Publication Date: 2023-08-29
- Inventor: Tae Ho Yoon , Yang Gyoo Jung , Min Ho Kim , Youn Seok Song , Dong Soo Ryu , Choong Hoe Kim
- Applicant: Amkor Technology Singapore Holding Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: Amkor Technology Singapore Holding Pte. Ltd.
- Current Assignee: Amkor Technology Singapore Holding Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: McAndrews, Held & Malloy, Ltd.
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/00 ; G02B27/09 ; H01L23/31 ; H01L25/065 ; H01L25/00 ; H01L21/60
Abstract:
A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.
Public/Granted literature
- US20210082717A1 SYSTEM AND METHOD FOR LASER ASSISTED BONDING OF AN ELECTRONIC DEVICE Public/Granted day:2021-03-18
Information query
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