Invention Grant
- Patent Title: Apparatus for removing a photoresist and apparatus for manufacturing a comiconductor device
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Application No.: US18057397Application Date: 2022-11-21
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Publication No.: US11742222B2Publication Date: 2023-08-29
- Inventor: Jihun Cheon , Hyun Jung Lee , Pyojin Jeon , Yong-Jhin Cho , Wonjun Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: HARNESS, DICKEY & PIERCE, P.L.C.
- Priority: KR 20190058816 2019.05.20
- The original application number of the division: US16715123 2019.12.16
- Main IPC: H01L21/67
- IPC: H01L21/67 ; B08B7/00 ; B08B3/02 ; B08B7/04 ; G03F7/30 ; B08B5/02
Abstract:
An apparatus for fabricating a semiconductor device may include a nozzle having a slit configured to eject solution and an ultraviolet emitter provided outside the nozzle. The ultraviolet emitter and the nozzle may be configured to move horizontally. The slit may be provided on a bottom surface of the nozzle.
Public/Granted literature
- US20230097611A1 APPARATUS FOR REMOVING A PHOTORESIST AND APPARATUS OF MANUFACTURING A SEMICONDUCTOR DEVICE Public/Granted day:2023-03-30
Information query
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