Invention Grant
- Patent Title: Substrate chuck and substrate bonding system including the same
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Application No.: US17189941Application Date: 2021-03-02
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Publication No.: US11742224B2Publication Date: 2023-08-29
- Inventor: Youngbin Choi , Heebok Kang
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Myers Bigel, P.A.
- Priority: KR 20150183959 2015.12.22
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/687 ; H01L21/683
Abstract:
Provided are a substrate chuck and a substrate bonding system including the substrate chuck. The substrate bonding system includes a lower substrate chuck and an upper substrate chuck disposed on the lower substrate chuck. The lower substrate chuck has a non-flat lower substrate contact surface, and the upper substrate chuck has a flat upper substrate contact surface.
Public/Granted literature
- US20210183667A1 SUBSTRATE CHUCK AND SUBSTRATE BONDING SYSTEM INCLUDING THE SAME Public/Granted day:2021-06-17
Information query
IPC分类:
