A wiring substrate includes: an insulating substrate being shaped in a quadrangle in a plan view, including a mounting portion where an electronic component is mounted on a side of a principal surface of the insulating substrate, and having a recess on a side surface thereof; an inner surface electrode which is located on an inner surface of the recess; a via conductor which is located on a corner side of the insulating substrate in a perspective plan view and has both ends located in a thickness direction of the insulating substrate; and a wiring conductor, on the side of the principal surface of the insulating substrate, connecting the mounting portion, the inner surface electrode, and the via conductor, wherein, in a perspective plan view, the wiring conductor has a wiring conductor absent region which surrounds a region located between the mounting portion and the via conductor.