Invention Grant
- Patent Title: Hybrid channel semiconductor device and method
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Application No.: US17745655Application Date: 2022-05-16
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Publication No.: US11742387B2Publication Date: 2023-08-29
- Inventor: Pei-Yu Wang , Pei-Hsun Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- The original application number of the division: US16787306 2020.02.11
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L29/06 ; H01L29/08 ; H01L29/423 ; H01L21/02 ; H01L29/66 ; H01L21/3065 ; H01L21/762 ; H01L21/306 ; H01L29/78 ; H01L27/088 ; H01L21/3105

Abstract:
A device includes a first semiconductor strip protruding from a substrate, a second semiconductor strip protruding from the substrate, an isolation material surrounding the first semiconductor strip and the second semiconductor strip, a nanosheet structure over the first semiconductor strip, wherein the nanosheet structure is separated from the first semiconductor strip by a first gate structure including a gate electrode material, wherein the first gate structure partially surrounds the nanosheet structure, and a first semiconductor channel region and a semiconductor second channel region over the second semiconductor strip, wherein the first semiconductor channel region is separated from the second semiconductor channel region by a second gate structure including the gate electrode material, wherein the second gate structure extends on a top surface of the second semiconductor strip.
Public/Granted literature
- US20220278200A1 HYBRID CHANNEL SEMICONDUCTOR DEVICE AND METHOD Public/Granted day:2022-09-01
Information query
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