Invention Grant
- Patent Title: Bulk acoustic resonator with heat dissipation structure and fabrication process
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Application No.: US17798345Application Date: 2020-08-12
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Publication No.: US11742824B2Publication Date: 2023-08-29
- Inventor: Linping Li , Jinghao Sheng , Zhou Jiang
- Applicant: JWL (ZHEJIANG) SEMICONDUCTOR CO., LTD.
- Applicant Address: CN Zhejiang
- Assignee: JWL (ZHEJIANG) SEMICONDUCTOR CO., LTD.
- Current Assignee: JWL (ZHEJIANG) SEMICONDUCTOR CO., LTD.
- Current Assignee Address: CN Zhejiang
- Agency: The Belles Group, P.C.
- Priority: CN 2010125577.0 2020.02.27
- International Application: PCT/CN2020/108710 2020.08.12
- International Announcement: WO2021/169187A 2021.09.02
- Date entered country: 2022-08-09
- Main IPC: H03H9/02
- IPC: H03H9/02 ; H03H3/02 ; H03H9/13 ; H03H9/17 ; H03H9/54

Abstract:
A bulk acoustic resonator having a heat dissipation structure, and a fabrication process are provided according to the present application. The bulk acoustic resonator includes a substrate, a metal heat dissipation layer formed on the base substrate and provided with an insulating layer on the surface thereof, and a resonance functional layer formed on the insulating layer, where the metal heat dissipation layer and the insulating layer together define a cavity on the substrate, a side wall of the cavity is formed by the insulating layer, and a bottom electrode layer in the resonance function layer covers the cavity.
Public/Granted literature
- US20230076029A1 BULK ACOUSTIC RESONATOR WITH HEAT DISSIPATION STRUCTURE AND FABRICATION PROCESS Public/Granted day:2023-03-09
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