Invention Grant
- Patent Title: Placing table and plasma processing apparatus
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Application No.: US17085591Application Date: 2020-10-30
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Publication No.: US11743973B2Publication Date: 2023-08-29
- Inventor: Dai Kitagawa
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: WEIHROUCH IP
- Priority: JP 14128852 2014.06.24 JP 15008447 2015.01.20
- Main IPC: H05B3/26
- IPC: H05B3/26 ; H01L21/683 ; H01L21/67 ; H01J37/32 ; H01L21/687

Abstract:
Provided is a placing table configured to place a workpiece thereon. The placing table includes: an electrostatic chuck configured to attract the workpiece; a support member configured to support a focus ring; and a metal base having a first region configured to support the electrostatic chuck and a second region configured to support the support member, the second region surrounding the first region. The support member includes: an intermediate layer formed of a ceramic sintered compact and supported on the second region via an adhesive; a thermally sprayed ceramic layer formed on the intermediate layer by a thermal spraying method; and a heater electrode provided within the thermally sprayed ceramic layer. The heater electrode is formed by the thermal spraying method.
Public/Granted literature
- US20210051772A1 PLACING TABLE AND PLASMA PROCESSING APPARATUS Public/Granted day:2021-02-18
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