An electronic device capable of suppressing a temperature rise of a heat generating component and reducing the size of the heat generating component. The electronic device comprising a first substrate on which a first electronic component that generates heat during operation and a first connector are mounted, a second substrate on which a second electronic component that generates heat during operation and a second connector are mounted, and a cable having one end connected to the first connector and the other end connected to the second connector. In the electronic device, the second substrate has a hole defining the second substrate into a first region and a second region, and the cable is inserted through the hole, and on the second substrate, the second connector is mounted in the first region, and the second electronic component is mounted in the second region.