Invention Grant
- Patent Title: Optimal control logic in liquid cooling solution for heterogeneous computing
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Application No.: US16827353Application Date: 2020-03-23
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Publication No.: US11744040B2Publication Date: 2023-08-29
- Inventor: Shuai Shao , Tianyi Gao
- Applicant: Baidu USA LLC
- Applicant Address: US CA Sunnyvale
- Assignee: BAIDU USA LLC
- Current Assignee: BAIDU USA LLC
- Current Assignee Address: US CA Sunnyvale
- Agency: WOMBLE BOND DICKINSON (US) LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G05B13/00 ; G05B19/416 ; H05K7/14 ; G05B15/02

Abstract:
An electronic rack includes an array of server blades arranged in a stack. Each server blade contains one or more servers and each server includes one or more processors to provide data processing services. The electronic rack includes a coolant distribution unit (CDU) and a rack management unit (RMU). The CDU supplies cooling liquid to the processors and receives the cooling liquid carrying heat from the processors. The CDU includes a liquid pump to pump the cooling liquid. The RMU is configured to manage the operations of the components within the electronic rack such as CDU, etc. The RMU includes control logic to determine an optimal pump speed to minimize the total power consumption of the pump, acceleration servers and the host servers, based on the one or more parameters and the association between temperature and power consumption of the acceleration servers and the host servers. The RMU then controls the liquid pump based on the optimal pump speed.
Public/Granted literature
- US20210298202A1 OPTIMAL CONTROL LOGIC IN LIQUID COOLING SOLUTION FOR HETEROGENEOUS COMPUTING Public/Granted day:2021-09-23
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