An endoscopy system including an insertion tube segment, a handle segment, at least one heat source, a heat pipe and a heat-conductive material is provided. The insertion tube segment has first and second end portions opposite to each other and is inserted in the handle segment. An inside of the insertion tube segment and an inside of the handle segment commonly have a connecting space. The at least one heat source is disposed in the first end portion. The heat pipe is disposed in the connecting space and at least extends from a portion of the connecting space of the insertion tube segment to a portion of the connecting space of the handle segment. The heat-conductive material is disposed between the at least one heat source and the first end portion, and the heat-conductive material is thermally coupled to the at least one heat source and the heat pipe, respectively.