Invention Grant
- Patent Title: Laser assisted wound healing protocol and system
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Application No.: US15811651Application Date: 2017-11-13
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Publication No.: US11745026B2Publication Date: 2023-09-05
- Inventor: Margaret V. Kalmeta
- Applicant: THE BIOREGENTECH INSTITUTE, INC.
- Applicant Address: US CA Irvine
- Assignee: THE BIOREGENTECH INSTITUTE, INC.
- Current Assignee: THE BIOREGENTECH INSTITUTE, INC.
- Current Assignee Address: US CA Irvine
- Agency: PILLSBURY WINTHROP SHAW PITTMAN LLP
- Main IPC: A61N5/06
- IPC: A61N5/06 ; A61C1/00 ; A61K33/42 ; A61K38/39 ; A61C19/04 ; A61N5/067

Abstract:
The present invention provides for devices and methods of treating wounds, including general wounds, gum disease and gingival tissues post scaling/root planning, using a diode laser which generates a beam of light having a wavelength in the visible portion of the electromagnetic spectrum (400 nm-700 nm). Further disclosed are devices and methods capable of stimulating tissue regeneration at the site of a wound.
Public/Granted literature
- US20180154172A1 LASER ASSISTED WOUND HEALING PROTOCOL AND SYSTEM Public/Granted day:2018-06-07
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