Invention Grant
- Patent Title: Additive manufacturing method
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Application No.: US17356544Application Date: 2021-06-24
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Publication No.: US11745267B2Publication Date: 2023-09-05
- Inventor: Hong-Chuong Tran , Yu-Lung Lo , Haw-Ching Yang , Fan-Tien Cheng
- Applicant: NATIONAL CHENG KUNG UNIVERSITY
- Applicant Address: TW Tainan
- Assignee: NATIONAL CHENG KUNG UNIVERSITY
- Current Assignee: NATIONAL CHENG KUNG UNIVERSITY
- Current Assignee Address: TW Tainan
- Agency: CKC & Partners Co., LLC
- Main IPC: B22F10/364
- IPC: B22F10/364 ; B22F10/37 ; B22F10/85 ; B22F10/28 ; B33Y50/02 ; B33Y10/00 ; B33Y40/20

Abstract:
An additive manufacturing (AM) method is provided. The method includes performing a laser powder bed fusion (L-PBF) process on the powder layer. Then, a first surface roughness value of the powder layer after the L-PBF process is obtained to generate a first surface profile. An absorptivity and a set of re-melting process parameters data are used to perform a heat transfer simulation. A second surface profile of the powder layer after laser re-melting is obtained by using the first surface profile and a low-pass filter. Then, the set of re-melting process parameters data is adjusted iteratively to perform the heat transfer simulation until a second surface roughness value predicted from the second surface profile is smaller than or equal to a surface roughness threshold, thereby obtaining optimal values of re-melting process parameters for performing a re-melting process to reduce a surface roughness of a powder layer after the L-PBF process.
Public/Granted literature
- US20210402476A1 ADDITIVE MANUFACTURING METHOD Public/Granted day:2021-12-30
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