Invention Grant
- Patent Title: Metal material solid-phase bonding method and solid-phase bonding device
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Application No.: US16981001Application Date: 2019-02-22
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Publication No.: US11745287B2Publication Date: 2023-09-05
- Inventor: Hidetoshi Fujii , Yoshiaki Morisada , Huihong Liu , Yasuhiro Aoki , Masayoshi Kamai
- Applicant: OSAKA UNIVERSITY
- Applicant Address: JP Suita
- Assignee: OSAKA UNIVERSITY
- Current Assignee: OSAKA UNIVERSITY
- Current Assignee Address: JP Osaka
- Agency: WHDA, LLP
- Priority: JP 18053392 2018.03.20
- International Application: PCT/JP2019/006719 2019.02.22
- International Announcement: WO2019/181360A 2019.09.26
- Date entered country: 2020-09-15
- Main IPC: B23K20/00
- IPC: B23K20/00 ; B23K20/02 ; B23K103/04

Abstract:
To provide a solid phase welding method and a solid phase welding apparatus which are possible to accurately control the welding temperature, to lower the welding temperature and to achieve a solid phase welding of the metallic materials. The present invention provides a solid phase welding method for metallic materials comprising, a first step of forming an interface to be welded by abutting end portions of one material to be welded and the other material to be welded and applying a pressure in a direction substantially perpendicular to the interface to be welded, a second step of raising a temperature of the vicinity of the interface to be welded to a welding temperature by an external heating means, wherein the pressure is set to equal to or more than the yield strength of the one material to be welded and/or the other material to be welded at the welding temperature.
Public/Granted literature
- US20210107087A1 METAL MATERIAL SOLID-PHASE BONDING METHOD AND SOLID-PHASE BONDING DEVICE Public/Granted day:2021-04-15
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