In an abrasive body used for polishing by a CMP method, provided with a resin structure, a plurality of abrasive grains, and a plurality of longitudinal pores, and made in a form of disc, the longitudinal pore has a length in a thickness direction of the abrasive body longer than a length in a planar direction of the abrasive body, the resin structure includes communicating pores each of which communicating with the longitudinal pore and/or communicating with other communicating pore, the communicating pores include at least one of the abrasive grains in the pores respectively, and the average diameter of the communicating pores is not more than 18 times larger than the average diameter of the abrasive grains.