Invention Grant
- Patent Title: Multi-wall thickness, thin-walled honeycomb bodies, and extrusion dies and methods therefor
-
Application No.: US16954250Application Date: 2018-12-16
-
Publication No.: US11745384B2Publication Date: 2023-09-05
- Inventor: Ravindra Kumar Akarapu , Amit Halder , Priyank Paras Jain , Weidong Li
- Applicant: CORNING INCORPORATED
- Applicant Address: US NY Corning
- Assignee: Corning, Incorporated
- Current Assignee: Corning, Incorporated
- Current Assignee Address: US NY Corning
- Agent Joseph M. Homa
- International Application: PCT/US2018/065893 2018.12.16
- International Announcement: WO2019/125971A 2019.06.27
- Date entered country: 2020-06-16
- Main IPC: B28B3/26
- IPC: B28B3/26 ; B29C48/11 ; B29C48/32 ; B29C48/30 ; B29C48/345 ; B29C48/00 ; B01D46/24 ; B01D53/94 ; B01J35/04 ; B28B3/20 ; F01N3/28

Abstract:
A thin-walled honeycomb body (100) having a plurality of repeating cell structures (110) formed of intersecting porous thick walls (112V, 112H) and thin walls (114V, 114H). Each repeating cell structure (110) is bounded on its periphery by the thick walls (112V, 122H) of a first transverse thickness (Tk) and the thin walls (114V, 114H) have a second transverse thickness (Tt) that subdivides each repeating cell structure (110) into between 7 and 36 individual cells (108). In the thin-walled honeycomb body (100), the first transverse thickness (Tk) of the thick walls (112V, 112H) is less than or equal to 0.127 mm (0.005 inch) and the second transverse thickness (Tt) of the thin walls (114V, 114H) is less than or equal to 0.0635 mm (0.0025 inch), and Tk>Tt. Honeycomb extrusion dies and methods of manufacturing the thin-walled honeycomb body (100) having thick walls (112V, 112H) and thin walls (114V, 114H) are provided.
Public/Granted literature
- US20210362370A1 MULTI- WALL THICKNESS, THIN-WALLED HONEYCOMB BODIES, AND EXTRUSION DIES AND METHODS THEREFOR Public/Granted day:2021-11-25
Information query