Invention Grant
- Patent Title: Injection molding system, molding condition correction system, and injection molding method
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Application No.: US17330528Application Date: 2021-05-26
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Publication No.: US11745403B2Publication Date: 2023-09-05
- Inventor: Ryotaro Shimada , Satoshi Arai
- Applicant: Hitachi, Ltd.
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Crowell & Moring LLP
- Priority: JP 20092201 2020.05.27
- Main IPC: B29C45/77
- IPC: B29C45/77 ; B29C45/76 ; B29C45/78 ; B29C45/80

Abstract:
An injection molding system includes a step of determining a manufacturing condition including a combination of a first mold and a first injection molding machine, a step of confirming presence or absence of a first track record in production, in which a combination of the first mold and the first injection molding machine is used, by searching a production-track-record storage unit to, and a step of producing, in a case of the absence of the first track record in production, a corrected molding condition for injection molding by using the combination of the first injection molding machine and the first mold, based on first molding machine-specific information acquired in advance for the first injection molding machine, second molding machine-specific information acquired in advance for a second injection molding machine that is combined with the first mold and has a second track record in production, and the second track record in production acquired from the production-track-record storage unit. In the step, at least an amount of resin injected from the first injection molding machine into the first mold is corrected, and the produced corrected molding condition is inputted to the second injection molding machine.
Public/Granted literature
- US20210370568A1 Injection Molding System, Molding Condition Correction System, and Injection Molding Method Public/Granted day:2021-12-02
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