Invention Grant
- Patent Title: Material forming apparatus using diaphragm and material forming method using diaphragm
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Application No.: US17619343Application Date: 2020-09-10
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Publication No.: US11745408B2Publication Date: 2023-09-05
- Inventor: Suk Young Chey
- Applicant: Suk Young Chey
- Applicant Address: KR Seoul
- Assignee: Suk Young Chey
- Current Assignee: Suk Young Chey
- Current Assignee Address: KR Seoul
- Agency: Bridgeway IP Law Group, PLLC
- Agent Jihun Kim
- Priority: KR 20200013027 2020.02.04
- International Application: PCT/KR2020/012251 2020.09.10
- International Announcement: WO2021/157807A 2021.08.12
- Date entered country: 2021-12-15
- Main IPC: B29C51/28
- IPC: B29C51/28 ; B29C51/00 ; B29C51/26 ; B29C51/42

Abstract:
A material forming apparatus comprises: a support which is positioned at a side of a forming tool with respect to a material arranged on the forming tool to have a first part covered by the forming tool and a second part separated from the forming tool, and which supports the forming tool; a diaphragm which presses the second part of the material while the outer surface of the expanded diaphragm comes in close contact therewith, in a state in which the first part of the material is compressed by the forming tool and the outer surface of the diaphragm; and a volume-varying member which is disposed near the forming tool between the diaphragm and the support so that at least a portion thereof is positioned on the second part of the material.
Public/Granted literature
- US20220203598A1 MATERIAL FORMING APPARATUS AND MATERIAL FORMING METHOD Public/Granted day:2022-06-30
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