Invention Grant
- Patent Title: Conductive laminate and method for manufacturing the same
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Application No.: US17719551Application Date: 2022-04-13
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Publication No.: US11745469B2Publication Date: 2023-09-05
- Inventor: Tzu-Chien Wei , Wei-Yen Wang
- Applicant: National Tsing Hua University
- Applicant Address: TW Hsinchu
- Assignee: NATIONAL TSING HUA UNIVERSITY
- Current Assignee: NATIONAL TSING HUA UNIVERSITY
- Current Assignee Address: TW Hsinchu
- Agency: Li & Cai Intellectual Property (USA) Office
- Priority: TW 7134388 2018.09.28
- Main IPC: B32B15/20
- IPC: B32B15/20 ; B32B3/10 ; B32B7/12 ; B32B15/082 ; B32B27/28 ; B32B27/30 ; H01L21/768 ; H01L23/532

Abstract:
A method for manufacturing a conductive laminate and a conductive laminate are provided. The method for manufacturing the conductive laminate includes steps of: providing a substrate having a surface; immersing the substrate into a modifying solution including a silane with a hydrophilic group to form a discontinuous modified layer on the surface of the substrate; forming a barrier layer on the surface of the substrate and the discontinuous modified layer, and forming a conductive layer on a surface of the barrier layer. The barrier layer includes a polymer, and the polymer is selected from the group consisting of: polyvinyl alcohol, polyvinylpyrrolidone, polyacrylic acid, polyethylene glycol, and any combination thereof.
Public/Granted literature
- US20220242093A1 CONDUCTIVE LAMINATE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2022-08-04
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