Invention Grant
- Patent Title: Fluororesin substrate laminate
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Application No.: US17081090Application Date: 2020-10-27
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Publication No.: US11745482B2Publication Date: 2023-09-05
- Inventor: Kosuke Murai , Takao Tanigawa , Minoru Kakitani , Makoto Yanagida , Mami Shimada
- Applicant: Showa Denko Materials Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: RESONAC CORPORATION
- Current Assignee: RESONAC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: FITCH, EVEN, TABIN & FLANNERY, LLP
- Priority: JP 19195963 2019.10.29
- Main IPC: B32B27/32
- IPC: B32B27/32 ; B32B7/12 ; B32B15/085 ; C09J7/24 ; C09J7/30 ; C09J139/04

Abstract:
The present disclosure relates to a fluororesin substrate laminate for a high-frequency circuit, the fluororesin substrate laminate including a fluororesin substrate and an adhesive layer provided on the fluororesin substrate, wherein the adhesive layer includes a resin composition containing: (A) a maleimide compound having a saturated or unsaturated divalent hydrocarbon group; and (B) an aromatic maleimide compound.
Public/Granted literature
- US20210187923A1 FLUORORESIN SUBSTRATE LAMINATE Public/Granted day:2021-06-24
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