Invention Grant
- Patent Title: Wiring harness, vehicle component, mold, mold system and method for manufacturing the wiring harness
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Application No.: US17512914Application Date: 2021-10-28
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Publication No.: US11745675B2Publication Date: 2023-09-05
- Inventor: Martin Einert , Gotz Roderer , Dietrich Von Knorre , Aldo Navarro Malaga , Adam Neal
- Applicant: YAZAKI SYSTEMS TECHNOLOGIES GMBH
- Applicant Address: DE Regensburg
- Assignee: YAZAKI SYSTEMS TECHNOLOGIES GMBH
- Current Assignee: YAZAKI SYSTEMS TECHNOLOGIES GMBH
- Current Assignee Address: DE Regensburg
- Agency: Sughrue Mion, PLLC
- Priority: DE 2016108522.7 2016.05.09
- The original application number of the division: US16099913
- Main IPC: B60R16/02
- IPC: B60R16/02 ; B29C45/14 ; H01B7/00 ; H01B7/36 ; H01B13/012 ; B29L31/34
Abstract:
A wiring harness (1010), a motor vehicle component (1000), a mold (15) for manufacturing a wiring harness (1010), a mold system (10) and a method for manufacturing the wiring harness (1010), the wiring harness (1010) comprising at least one bunch (1020) of at least two cables (1025) and a sheath (1030), at least some sections of the bunch (1020) of cables being embedded in the sheath (1030).
Information query
