Invention Grant
- Patent Title: Microelectromechanical microphone with membrane trench reinforcements and method of fabrication
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Application No.: US17308340Application Date: 2021-05-05
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Publication No.: US11746001B2Publication Date: 2023-09-05
- Inventor: Pirmin Hermann Otto Rombach , Kurt Rasmussen , Dennis Mortensen , Cheng-Yen Liu , Morten Ginnerup , Jan Tue Ravnkilde , Jotaro Akiyama
- Applicant: TDK Electronics AG , TDK Corporation
- Applicant Address: DE Munich
- Assignee: TDK Electronics AG,TDK Corporation
- Current Assignee: TDK Electronics AG,TDK Corporation
- Current Assignee Address: DE Munich; JP Tokyo
- Agency: Slater Matsil, LLP
- Main IPC: B81B3/00
- IPC: B81B3/00 ; B81C1/00 ; H04R1/08

Abstract:
A microelectromechanical (MEMS) microphone with membrane trench reinforcements and method of fabrication is provided. The MEMS microphone includes a flexible plate and a rigid plate mechanically coupled to the flexible plate. The MEMS microphone includes a stoppage member affixed to the rigid plate and extending perpendicular relative to a surface of the rigid plate opposite the surface of the flexible plate. The stoppage member limits motion of the flexible plate. The rigid plate includes a reverse bending edge that include a first lateral etch stop that includes a first corner radius and a second lateral etch stop that includes a second corner radius. The first corner radius is more than 100 nanometers and the second corner radius is more than 25 nanometers. Further, a lateral step width between the first corner radius and the second corner radius is less than around 4 micrometers.
Public/Granted literature
- US20210347635A1 MICROELECTROMECHANICAL MICROPHONE WITH MEMBRANE TRENCH REINFORCEMENTS AND METHOD OF FABRICATION Public/Granted day:2021-11-11
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