Invention Grant
- Patent Title: Compound, resin composition and laminated substrate thereof
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Application No.: US17138254Application Date: 2020-12-30
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Publication No.: US11746083B2Publication Date: 2023-09-05
- Inventor: Jyh-Long Jeng , Jeng-Yu Tsai , Wei-Ta Yang
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: C08G18/78
- IPC: C08G18/78 ; C07C271/58 ; C08G18/34
Abstract:
A compound, a resin composition and a laminated substrate thereof are provided. The compound has a structure represented by Formula (I)
wherein A1 is C24-48 alkylene group, C24-48 alkenylene group, C24-48 alkynylene group, C24-48 alicyclic alkylene group, C24-48 alicyclic alkenylene group, or C24-48 alicyclic alkynylene group. A2 is C2-12 alkylene group, C6-C25 arylene group with two reactive groups, C4-8 cycloalkylene group, C5-25 heteroarylene group, divalent C7-C25 alkylaryl group, divalent C7-25 acylaryl group, divalent C6-25 aryl ether group, or divalent C7-25 acyloxyaryl group; and, n≥1.
wherein A1 is C24-48 alkylene group, C24-48 alkenylene group, C24-48 alkynylene group, C24-48 alicyclic alkylene group, C24-48 alicyclic alkenylene group, or C24-48 alicyclic alkynylene group. A2 is C2-12 alkylene group, C6-C25 arylene group with two reactive groups, C4-8 cycloalkylene group, C5-25 heteroarylene group, divalent C7-C25 alkylaryl group, divalent C7-25 acylaryl group, divalent C6-25 aryl ether group, or divalent C7-25 acyloxyaryl group; and, n≥1.
Public/Granted literature
- US20220204442A1 COMPOUND, RESIN COMPOSITION AND LAMINATED SUBSTRATE THEREOF Public/Granted day:2022-06-30
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