Invention Grant
- Patent Title: Hard-mask forming composition, method for manufacturing electronic component, and resin
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Application No.: US17175182Application Date: 2021-02-12
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Publication No.: US11746189B2Publication Date: 2023-09-05
- Inventor: Keiichi Ibata
- Applicant: TOKYO OHKA KOGYO CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee Address: JP Kawasaki
- Agency: KNOBBE, MARTENS, OLSON & BEAR LLP
- Priority: JP 20027378 2020.02.20
- Main IPC: C08G73/06
- IPC: C08G73/06 ; C09D179/04 ; H01L21/027 ; G03F7/11 ; H01L21/033
Abstract:
A hard-mask forming composition including a resin (P1) having a repeating structure (u1) represented by General Formula (u1-0), wherein Ar01 and Ar02 are aromatic hydrocarbon groups which may have a substituent, Ar02 has at least one nitrogen atom or oxygen atom, L01 and L02 are each independently a single-bonded or divalent linking group, and X is NH4 and the like
Public/Granted literature
- US20210261731A1 HARD-MASK FORMING COMPOSITION, METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND RESIN Public/Granted day:2021-08-26
Information query
