Invention Grant
- Patent Title: Heat-expandable microspheres and applications thereof
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Application No.: US16966297Application Date: 2019-01-16
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Publication No.: US11746205B2Publication Date: 2023-09-05
- Inventor: Naoya Tayagaki , Katsushi Miki
- Applicant: MATSUMOTO YUSHI-SEIYAKU CO., LTD.
- Applicant Address: JP Yao
- Assignee: MATSUMOTO YUSHI-SEIYAKU CO., LTD.
- Current Assignee: MATSUMOTO YUSHI-SEIYAKU CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP 18014704 2018.01.31
- International Application: PCT/JP2019/001096 2019.01.16
- International Announcement: WO2019/150951A 2019.08.08
- Date entered country: 2020-07-30
- Main IPC: C08J9/20
- IPC: C08J9/20 ; C08J9/232 ; C08F236/12 ; C08J9/224 ; B01J13/14

Abstract:
Heat-expandable microspheres including a thermoplastic resin shell and a thermally-vaporizable blowing agent encapsulated therein. The thermoplastic resin is a polymer of a polymerizable component containing a cross-linkable monomer (A) which has at least two (meth)acryloyl groups per molecule and a reactive carbon-carbon double bond in addition to the (meth)acryloyl groups and has a molecular weight of at least 500. Also disclosed are hollow resin particles manufactured by expanding the heat-expandable microspheres; fine-particle-coated hollow resin particles including the hollow resin particles; a composition including a base component and the heat-expandable microspheres, or hollow resin particles, or fine-particle coated hollow resin particles; and a formed article manufactured by forming the composition.
Public/Granted literature
- US20210363320A1 HEAT-EXPANDABLE MICROSPHERES AND APPLICATION THEREOF Public/Granted day:2021-11-25
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